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 Post subject: [TMS570]New LP coming soon
PostPosted: Thu Apr 16, 2015 12:27 am 
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I have it on good authority, TI is going to be releasing a new TMS570 / R5F based LaunchPad soon.

If there's interest, I'll post more when I know more.

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 Post subject: Re: [TMS570]New LP coming soon
PostPosted: Thu Apr 16, 2015 10:31 am 
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Quote:
If there's interest ...

Of course. Let us know the second you find out anything interesting. If it is an LP for the LC4357/RM57 at the same low price as the LAUNCHXL2 that would be incredible. Hopefully, they have fixed the borken "back channel" on the JTAG debugger. I'd like to see TI make some low to low-mid range MCU with R5F and the same 65 nm fab process as the LC4357/RM57 or better (there should be a lot of excellent used 45 nm and even 32 nm equipment out there now since all the major PC and mobile chip manufacturers have moved on to 28 nm and beyond (some way beyond).


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 Post subject: Re: [TMS570]New LP coming soon
PostPosted: Fri Apr 24, 2015 2:36 pm 
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abecedarian wrote:
AFAIK it's BGA.

If it's BGA that would tend to indicate TMS570LC4357/RM57 which are not available in LQFP. Of course, either would be overkill for any current DIY engine management project.

russian wrote:
I believe that LQFP is with-in DIY spectrum and BGA is not.

There are a number of DIY options for using BGA packaged devices including paying the PCB fab to mount a single large device or using a burn-in socket (expensive but practical in a low-volume, dev environment). In addition, there are many articles on the web about using convective ovens made for kitchen use for doing solder reflow. Admittedly, an advanced DIY technique. The BGA package has advantages other than small size. It's possible to dissipate heat more efficiently through the ground balls which are generally more numerous and well distributed on a BGA device. The 337NFBGA package of the TMS570LC4357/RM57 isn't a particularly large one.

In other news, there is a user "Nobody" posting again on the rusEFI forum. Hard to believe it's the same Nobody who started the big flap with Andrey and kb1gtt last summer which spilled over onto this forum. If it is, that would be just weird.


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 Post subject: Re: [TMS570]New LP coming soon
PostPosted: Fri Apr 24, 2015 8:09 pm 
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Actually, the MCU's used on the LAUNCHXL2 LP's are available in BGA as are even lesser capable chips, so one really can't draw much of a conclusion from that revelation... unless you assume I meant it's "only" available in BGA, which I didn't state anything other than the new LP, as far as I know, is BGA. BGA as opposed to LQFP, regardless of which chip, adds functionality the LQFP doesn't provide, often additional GPIO.

And I think all I've alluded to previously is the new LP's are more capable than the previous and BGA is the most likely land pattern. ;)

Home-made re-flow ovens are quite common in the DIY sphere, so with a good board and a good eye, DIY BGA shouldn't be a huge problem. There are even Arduino-esque and MSP430 reflow controllers with programmable profiles and such so one could build something for under $100 USD.


Re: some new "Nobody"... I haven't seen any posts like that. I have an open mind and even if "Nobody" came back, I wouldn't hold a grudge, so long as things remain civil and respectful there shouldn't be any problems.

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 Post subject: Re: [TMS570]New LP coming soon
PostPosted: Mon Apr 27, 2015 9:32 pm 
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So when is the big day? It's not nice to tease
something too soon and then ...
nothing.


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 Post subject: Re: [TMS570]New LP coming soon
PostPosted: Mon Apr 27, 2015 10:42 pm 
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US56 wrote:
So when is the big day? It's not nice to tease
something too soon and then ...
nothing.

Formal reveal is supposed to be near the end of May, so not too far away.

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 Post subject: Re: [TMS570]New LP coming soon
PostPosted: Thu May 21, 2015 9:03 pm 
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Purportedly pushed to early / mid June now due to a design issue with the board.

Also, some rumors surfacing of other chips being announced around the same time.

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 Post subject: Re: [TMS570]New LP coming soon
PostPosted: Sat May 30, 2015 7:31 pm 
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Someone at TI let it slip on the
TI Wiki Hercules page.

Scroll to the bottom and look under "L".

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 Post subject: Re: [TMS570]New LP coming soon
PostPosted: Sat May 30, 2015 8:25 pm 
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So according to the page, the new LP is based on TMS570LC4357. It supports 2 standard 40 pin TI BoosterPack headers and 4, 60 pin mezzanine connectors, to bring the I/O out for access. Also has built-in Ethernet support.

That's about all I know for now, other than what's on that page since I haven't opened mine up yet.

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 Post subject: Re: [TMS570]New LP coming soon
PostPosted: Sun May 31, 2015 7:23 pm 
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Attachment:
IMG_20150531_102949122.jpg
IMG_20150531_102949122.jpg [ 560.67 KiB | Viewed 10783 times ]

LC4357 <--> LS1224

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 Post subject: Re: [TMS570]New LP coming soon
PostPosted: Mon Jun 01, 2015 12:49 pm 
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Presuming the price point is the same as the other LAUNCHXL2 demo boards it's an incredible amount of bang-for-the-buck. Giving that much power to hackers and tinkerers is like giving a 16 year old kid an old muscle car with a big block engine.


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 Post subject: Re: [TMS570]New LP coming soon
PostPosted: Thu Jun 11, 2015 9:10 pm 
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Officially announced and based on TMS570LC4357 as expected:
http://www.ti.com/ww/en/launchpad/launc ... 0LC43.html

$29.99 USD.

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My O5E candidate: 1982 Honda CX500TC motorcycle.


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 Post subject: Re: [TMS570]New LP coming soon
PostPosted: Fri Jun 12, 2015 11:07 am 
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Ho hum. Pretty much what everyone thought it would be. The price is not a surprise either. Still, not a bad deal for what it can do. If the JTAG is fully functional (ARM JTAG compliant), I might even get one.


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 Post subject: Re: [TMS570]New LP coming soon
PostPosted: Sat Jun 13, 2015 3:24 pm 
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Not really sure why JTAG functionality would be an influence on your decision, but I can respect that. I surmise that since the official tool chain for these are mostly Windows based, that might be a put-off for you, correct?

If you're on Linux, I believe the ancillary tools like HalCoGen and FMzPLL will run under WINE, and there are Linux versions of Code Composer Studio and the Hercules' compiler, and CCS can also be set up to use GCC and other compilers with appropriate modifications to the linker scripts and such.

The code generated by the helper tools are BSD licensed so even though 'how' they generate the code using black-box methods, what they generate is basically free to distribute without hindrance from any sort of proprietary considerations. I.e. once the basic framework of the firmware has been established and the tools have generated the source code, that source code is unencumbered by any licensing restrictions.

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 Post subject: Re: [TMS570]New LP coming soon
PostPosted: Sun Jun 14, 2015 2:13 pm 
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abecedarian wrote:
Not really sure why JTAG functionality would be an influence on your decision

Remember, the JTAG "channel B" aka "data channel" aka "back channel" is inoperative on the original LAUNCHXL2. Some time ago, I mentioned to you how useful having that capability would be for doing real-world performance evaluation of the TMS570Lx for engine management app's.


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 Post subject: Re: [TMS570]New LP coming soon
PostPosted: Sun Jun 14, 2015 8:49 pm 
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US56 wrote:
abecedarian wrote:
Not really sure why JTAG functionality would be an influence on your decision

Remember, the JTAG "channel B" aka "data channel" aka "back channel" is inoperative on the original LAUNCHXL2. Some time ago, I mentioned to you how useful having that capability would be for doing real-world performance evaluation of the TMS570Lx for engine management app's.

The new LP enumerates on USB as 5 devices:
- USB Input Device | HID-compliant vendor device
- 2 x USB-Serial devices;
- XDS110 Class Data Port;
- XDS110 Class Debug Probe.

Strangely enough, plugging the older LAUNCHXL2 / LS1224 board in results in the same devices being enumerated with only the COM port assignments being different. It's possible updates to CCS included drivers that altered some functionality of the XDS110 ICDI. I do know there was talk about the debug functionality being updated to include power usage monitoring so that may explain the additional USB-Serial device and the HID-Compliant vendor device.

Given this is being done over one USB 2.0 connection, I don't have 3.0 here, but even then the bandwidth will still be limited to some extent.

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 Post subject: Re: [TMS570]New LP coming soon
PostPosted: Sun Jun 14, 2015 9:13 pm 
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I've got a CRAZY idea...why don't you 2 actually code something instead of all this blah blah about what features different dev boards have or don't have?

I' don't say that to be mean, but over the years I've noticed the almost nothing ever gets done until after it gets started ;)


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 Post subject: Re: [TMS570]New LP coming soon
PostPosted: Sun Jun 14, 2015 10:03 pm 
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mk e wrote:
I've got a CRAZY idea...why don't you 2 actually code something instead of all this blah blah about what features different dev boards have or don't have?

I' don't say that to be mean, but over the years I've noticed the almost nothing ever gets done until after it gets started ;)

No worries. There's been lots of looks, but little interest so I've locked things.

Interested users can PM me and I'll look at re-opening things.

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My O5E candidate: 1982 Honda CX500TC motorcycle.


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